9th International Conference on Electrical and Electronics Engineering (ICEEE 2026)

9th International Conference on Electrical and Electronics Engineering (ICEEE 2026)
March 30 ~ 31, 2026, Virtual Conference
https://iceee2026.org/
Scope
9th International Conference on Electrical and Electronics Engineering (ICEEE 2026) serves as a premier global forum dedicated to advancing research, innovation, and industrial applications across the full spectrum of Electrical and Electronics Engineering. The conference aims to bring together leading researchers, academicians, industry professionals, and practitioners to exchange knowledge, discuss emerging trends, and explore cutting edge developments shaping the future of the field.
ICEEE 2026 provides a dynamic platform for presenting original research contributions, breakthrough technologies, and stateoftheart reviews. The conference welcomes high quality submissions that highlight novel ideas, experimental results, theoretical advancements, and real world industrial experiences. Contributions may include research papers, case studies, survey articles, and project demonstrations that showcase significant progress in Electrical and Electronics Engineering.
Authors are invited to submit manuscripts that illustrate innovative methodologies, practical implementations, and impactful findings across a wide range of topics. Submissions may address, but are not limited to, the areas listed below, reflecting both foundational disciplines and emerging frontiers within the field.
Topics of interest include, but are not limited to, the following
Power, Energy & Control Systems
• Smart Grids, Microgrids& Distributed Energy Systems
• Renewable & Sustainable Energy Technologies
• Power Electronics for Electric Vehicles & Transportation
• Fast Charging Systems & Vehicle to Grid (V2G) Technologies
• Energy Storage Systems & Battery Management
• High Voltage Engineering & Protection Systems
• Intelligent Control Systems & Automation
• Power System Stability, Optimization & Resilience
Electronics, Circuits & Semiconductor Technologies
• Analog, Mixed Signal & RF Circuit Design
• High Performance Digital & Low Power Circuit Design
• Nanoelectronics, 2D Materials & Emerging Semiconductor Devices
• Neuromorphic, Spintronic & Quantum Devices
• VLSI, SoC, NoC & Hardware Security
• Electronic Packaging, Reliability & Thermal Management
• Flexible, Printed & Organic Electronics
• Electronic & Photonic Materials

Communication, Networking & Signal Processing
• 5G/6G Wireless Systems & Beyond
• Terahertz Communications & Reconfigurable Intelligent Surfaces (RIS)
• Optical Communication & Photonic Integrated Circuits
• Satellite, UAV & Space Communications
• IoT, Edge Computing & Cyber Physical Systems
• AI Driven Signal Processing & Communication Optimization
• Network Security, Privacy & Blockchain Enabled Systems
• Computational Imaging & Compressive Sensing
Electromagnetics, Antennas & Wave Engineering
• Advanced Antenna Design (MIMO, mmWave, THz)
• Metamaterials & Meta surfaces
• Electromagnetic Compatibility (EMC/EMI)
• Computational Electromagnetics & Wave Propagation
Embedded Systems, Robotics & Intelligent Machines
• Embedded AI, TinyML & Real Time Systems
• Robotics, Mechatronics & Autonomous Systems
• Autonomous Navigation, SLAM & Sensor Fusion
• Drones, UAV Navigation & Human Robot Interaction
• Avionics & Aerospace Electronics
• Cyber Physical Systems & Digital Twins
• Industrial Automation & Smart Manufacturing
• Embedded Security & Safety Critical Systems
Biomedical Engineering & Healthcare Technologies
• Biomedical Instrumentation & Wearable Health Devices
• Medical Imaging, Diagnostics & Bio signal Processing
• Neural Engineering, Brain Machine Interfaces & Prosthetics
• Bioelectronics, BioMEMS & LabonChip Systems
• AI in Healthcare & Computational Biology (EEE aligned)
Sensing, Imaging & Remote Technologies
• Advanced Sensor Technologies, MEMS/NEMS & Smart Sensing
• LiDAR, Radar, Multispectral & Hyperspectral Imaging
• Earth Observation, Remote Sensing & Geospatial Technologies
• Virtual Instrumentation & Precision Measurement Systems
Computing, AI & Emerging Technologies
• Machine Learning, Deep Learning & Generative AI for Engineering
• Trustworthy AI, Explainable AI & Safe ML
• Quantum Computing & Quantum Information Systems
• Cloud, Edge & Distributed Computing Architectures
• High Performance Computing & GPU/FPGA Acceleration
• Evolutionary Algorithms, Swarm Intelligence & Optimization
Interdisciplinary & Frontier Technologies
• Smart Cities, Intelligent Transportation & Infrastructure
• Internet of BioNano Things (IoBNT)
• Green Electronics & Sustainable Engineering
• Space Electronics, Radiation Hardened Systems & Deep Space Instrumentation
• AR/VR/MR Systems & Human Centered Computing

Paper Submission
Authors are invited to submit papers through the conference Submission System by March 21, 2026(Final Call). Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by International Journal on Cybernetics & Informatics (IJCI) (Confirmed).
Selected papers from ICEEE 2026, after further revisions, will be published in the special issue of the following journal.
• International Journal of Soft Computing, Mathematics and Control (IJSCMC)
• Electrical Engineering: An International Journal (EEIJ)
• Electrical and Electronics Engineering: An International Journal (ELELIJ)
Important Dates
Third Batch : (Submissions after January 31, 2026)

• Submission Deadline : March 21, 2026(Final Call)
• Authors Notification : March 28, 2026
• Registration & Camera-Ready Paper Due : March 30, 2026
Contact Us
Here's where you can reach us : [email protected] or [email protected]